| Development and application of interatomic potentials to study the stability and shear strength of Ti/TiN and Cu/TiN interfaces ASM Miraz, N Dhariwal, WJ Meng, BR Ramachandran, CD Wick Materials & Design 196, 109123, 2020 | 23 | 2020 |
| Computational study of metal/ceramic interfacial adhesion and barriers to shear displacement ASM Miraz, S Sun, S Shao, WJ Meng, BR Ramachandran, CD Wick Computational Materials Science 168, 104-115, 2019 | 17 | 2019 |
| Improvement of Ti/TiN interfacial shear strength by doping–A first principles density functional theory study ASM Miraz, E Williams, WJ Meng, BR Ramachandran, CD Wick Applied Surface Science 517, 146185, 2020 | 15 | 2020 |
| Low temperature growth of Cu thin films on TiN (001) templates: Structure and energetics X Zhang, S Shao, ASM Miraz, CD Wick, BR Ramachandran, WJ Meng Materialia 12, 100748, 2020 | 9 | 2020 |
| Computational observation of the strengthening of Cu/TiN metal/ceramic interfaces by sub-nanometer interlayers and dopants ASM Miraz, WJ Meng, BR Ramachandran, CD Wick Applied Surface Science 554, 149562, 2021 | 8 | 2021 |
| Impact of metal/ceramic interactions on interfacial shear strength: Study of Cr/TiN using a new modified embedded-atom potential N Dhariwal, ASM Miraz, WJ Meng, BR Ramachandran, CD Wick Materials & Design 210, 110120, 2021 | 5 | 2021 |
| Numerical analysis of deep level defects in Cu2ZnSnS4(CZTS) thin film solar cells ASM Miraz, MM Faruk, MA Rahman 2015 3rd international conference on green energy and technology (ICGET), 1-6, 2015 | 2 | 2015 |
| Strengthening the Ti/TiN interface against shear failure with Al dopants: A molecular dynamics study N Dhariwal, ASM Miraz, WJ Meng, CD Wick Applied Surface Science 613, 156024, 2023 | 1 | 2023 |
| Multi-Scale Computational Modeling of Metal/Ceramic Interfaces ASM Miraz Louisiana Tech University, 2021 | | 2021 |
Collin WickLouisiana Tech UniversityVerified email at latech.edu
