| Modular, multi-function digital-RF receiver systems D Gupta, DE Kirichenko, VV Dotsenko, R Miller, S Sarwana, ... IEEE transactions on applied superconductivity 21 (3), 883-890, 2010 | 89 | 2010 |
| Ultra-low heat leak YBCO superconducting leads for cryoelectronic applications RJ Webber, J Delmas, BH Moeckly IEEE transactions on applied superconductivity 19 (3), 999-1002, 2009 | 24 | 2009 |
| Annealing system and method J Delmas, CT Carlson, RB Vopat US Patent 10,643,867, 2020 | 23 | 2020 |
| High pressure and high temperature anneal chamber J Delmas, S Verhaverbeke, K Leschkies US Patent 10,636,677, 2020 | 23 | 2020 |
| Condenser system for high pressure processing system J Delmas US Patent 10,685,830, 2020 | 22 | 2020 |
| High pressure and high temperature anneal chamber J Delmas, S Verhaverbeke, K Leschkies US Patent 11,018,032, 2021 | 20 | 2021 |
| Integration of a 4-Stage 4 K pulse tube cryocooler prototype with a superconducting integrated circuit VV Dotsenko, J Delmas, RJ Webber, TV Filippov, DE Kirichenko, ... IEEE transactions on applied superconductivity 19 (3), 1003-1007, 2009 | 20 | 2009 |
| Cryogenic system with rapid thermal cycling RJ Webber, J Delmas US Patent 9,982,935, 2018 | 13 | 2018 |
| Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics RSE John, AP Malshe, V Dotsenko, J Delmas, R Webber, D Gupta 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 12 | 2010 |
| Initial Evaluation of a 4-K 4-Stage Pulse Tube Cryocooler for Superconducting Electronics R Webber, V Dotsenko, J Delmas, A Kadin, E Track Cryocoolers 15, 657, 665, 2009 | 10 | 2009 |
| Carbon nanotube based polymer adhesive as an underfill for superconductor multi-chip module packaging RSE John, CS Thompson, VV Dotsenko, J Delmas, AP Malshe, D Gupta IEEE transactions on applied superconductivity 21 (3), 900-903, 2010 | 9 | 2010 |
| Liquid lithium supply and regulation J Delmas, B Frey US Patent 11,198,604, 2021 | 8 | 2021 |
| Cool-down acceleration of GM cryocoolers with thermal oscillations passively damped by helium RJ Webber, J Delmas IOP Conference Series: Materials Science and Engineering 101 (1), 012137, 2015 | 7 | 2015 |
| Cryogenic tests of a 0.1 K dilution cooler for Planck-HFI L Sentis, J Delmas, P Camus, G Guyot, Y Blanc Cryocoolers 13, 533-542, 2005 | 6 | 2005 |
| Small thermal mass pressurized chamber R Gouk, HW Chen, S Verhaverbeke, J Delmas US Patent 10,304,703, 2019 | 5 | 2019 |
| Operation of YBCO current leads as bias lines to cryocooler-mounted 4 K superconducting electronics RJ Webber, J Delmas Physics Procedia 36, 256-261, 2012 | 5 | 2012 |
| Package core assembly and fabrication methods HW Chen, S Verhaverbeke, G Park, K Cho, K Leschkies, R Gouk, ... US Patent 12,087,679, 2024 | 4 | 2024 |
| Drying process for high aspect ratio features R Gouk, HW Chen, S Verhaverbeke, J Delmas US Patent 10,777,405, 2020 | 4 | 2020 |
| HTS tape-based multi-line current lead M Merker, J Delmas, R Webber AIP Conference Proceedings 1434 (1), 573-580, 2012 | 3 | 2012 |
| Laser ablation system for package fabrication K Leschkies, JL Franklin, WS Lei, S Verhaverbeke, J Delmas, HW Chen, ... US Patent 11,676,832, 2023 | 2 | 2023 |
Vladimir DotsenkoManager MCM, HYPRES, Inc.Verified email at hypres.com
