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M Shafkat M Khan
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Secure interposer-based heterogeneous integration
MSM Khan, C Xi, AA Khan, MT Rahman, MM Tehranipoor, ...
IEEE Design & Test 39 (6), 156-164, 2022
172022
Non-invasive blood glucose measurement using near infra-red spectroscopy
AT Priyoti, SJ Jim, S Hossain, S Mahmud, S Salvin, A Bhattacharjee
2019 IEEE R10 Humanitarian Technology Conference (R10-HTC)(47129), 1-4, 2019
82019
Exploring advanced packaging technologies for reverse engineering a system-in-package (sip)
MSM Khan, C Xi, MSU Haque, MM Tehranipoor, N Asadizanjani
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
62023
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
R Noor, HR Kottur, PJ Craig, LK Biswas, MSM Khan, N Varshney, H Dalir, ...
arXiv preprint arXiv:2310.11651, 2023
32023
Emerging nonvolatile memories—an assessment of vulnerability to probing attacks
LK Biswas, M Shafkat, M Khan, L Lavdas, N Asadizanjani
ISTFA 2022, 217-224, 2022
32022
Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis
C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024
THz-TDS for IC packaging material changes detection under real-world conditions
C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024
Antenna-in-Package Assurance with Radio Frequency Fingerprint
R Noor, LK Biswas, MSM Khan, YK Yoon, N Asadizanjani
ISTFA 2023, 323-328, 2023
2023
: An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-Inspection
MSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ...
2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023
2023
SECURITY ASSESSMENT OF NONVOLATILE MEMORY AGAINST PHYSICAL PROBING
LK Biswas, MSM Khan, L Lavdas, N Asadizanjani
2022
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Articles 1–10