| 10kV SiC MPS diodes for high temperature applications Y Jiang, W Sung, X Song, H Ke, S Liu, BJ Baliga, AQ Huang, E Van Brunt 2016 28th International Symposium on Power Semiconductor Devices and ICs …, 2016 | 29 | 2016 |
| Design, package, and hardware verification of a high-voltage current switch A De, AJ Morgan, VM Iyer, H Ke, X Zhao, K Vechalapu, S Bhattacharya, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 6 (1), 441-450, 2017 | 18 | 2017 |
| The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor W Sung, AQ Huang, BJ Baliga, I Ji, H Ke, DC Hopkins 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's …, 2015 | 14 | 2015 |
| Investigation of rapid-prototyping methods for 3D printed power electronic module development H Ke, A Morgan, R Aman, DC Hopkins International Symposium on Microelectronics 2014 (1), 000887-000892, 2014 | 8 | 2014 |
| Design and fabrication of high current AlGaN/GaN HFET for Gen III solid state transformer IH Ji, S Wang, B Lee, H Ke, V Misra, AQ Huang 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications, 63-65, 2014 | 7 | 2014 |
| Investigation of the insulation failure of power modules by observation of electrical trees K Li, B Zhang, X Li, H Ke 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2021 | 6 | 2021 |
| A high performance power module with> 10kV capability to characterize and test in situ SiC devices at> 200 C ambient X Zhao, H Ke, Y Jiang, A Morgan, Y Xu, DC Hopkins Additional Papers and Presentations 2016 (HiTEC), 000149-000158, 2016 | 6 | 2016 |
| Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package H Ke, Y Xu, DC Hopkins International Symposium on Microelectronics 2013 (1), 000758-000763, 2013 | 6 | 2013 |
| 3-D Prismatic packaging methodologies for wide band gap power electronics modules H Ke, U Mehrotra, DC Hopkins IEEE Transactions on Power Electronics 36 (11), 13057-13066, 2021 | 3 | 2021 |
| 3.3 kV/500A SiC Power Module for Railway Traction Application H Ke, G Chang, W Zhou, C Li, Y Peng, X Dai PCIM Asia 2018; International Exhibition and Conference for Power …, 2018 | 3 | 2018 |
| Ultra Low Leakage Module for 12kV-225 C SiC Semiconductor Testing X Zhao, H Ke, Y Jiang, A Morgan, Y Xu, DC Hopkins International Symposium on Microelectronics, Oct, 11-13, 2016 | 3 | 2016 |
| Additive manufacturing in power electronics packaging D Hopkins, H Ke Industry Session, 2015 Applied Power Electronics Conference, Charlotte, NC, USA, 2015 | 3 | 2015 |
| The influence of degassing time and curing time on insulation behaviours of silicone gel in IGBT modules K Li, B Zhang, X Li, H Ke IET Digital Library, 2021 | 2 | 2021 |
| 3-D prismatic packaging methodologies for wide band gap power electronics modules H Ke North Carolina State University, 2017 | 2 | 2017 |
| Mitigation of IGBT Gate Oscillation during Short Circuit through Module Layout Improvement H Ke, Y Teng, G Qin, H Feng, W Yu, Y Peng, L Tang PCIM Asia 2020; International Exhibition and Conference for Power …, 2020 | 1 | 2020 |
| Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors H Ke, Y Jiang, AJ Morgan, DC Hopkins International Symposium on Microelectronics 2017 (1), 000224-000230, 2017 | 1 | 2017 |
| A Robust, Composite Packaging Approach for a High Voltage 6.5 kV IGBT and Series Diode A Morgan, A De, H Ke, X Zhao, K Vechalapu, DC Hopkins, ... International Symposium on Microelectronics 2015 (1), 000359-000364, 2015 | 1 | 2015 |
| Influence of Al/CucorAl wire bonding on reliability of SiC devices C Fang, X Tang, G Qin, H Ke, Y Wu, J Zhang, G Chang, H Luo 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2021 | | 2021 |
| Heat Dissipation Performance Evaluation of Insulated Metal Substrate Based on Transient Analysis S Wei, Y Wu, H Ke, G Dong, Y Deng, G Chang, Y Wang, Y Peng, H Luo PCIM Europe digital days 2021; International Exhibition and Conference for …, 2021 | | 2021 |
| Numerical and Experimental Study on Improving the Surge Current Capability of IGBT Power Modules H Ke, Y Deng, Y Wu, J Fang, W Yu, G Chang, Y Peng PCIM Asia 2020; International Exhibition and Conference for Power …, 2020 | | 2020 |
Douglas C HopkinsProfessor of Electrical and Computer EngineeringVerified email at NCSU.EDU
