| METRICS2. 1 and Flow Tuning in the IEEE CEDA Robust Design Flow and OpenROAD ICCAD Special Session Paper J Jung, AB Kahng, S Kim, R Varadarajan 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 1-9, 2021 | 16 | 2021 |
| GRASP based metaheuristics for layout pattern classification M Woo, S Kim, S Kang 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 512-518, 2017 | 13 | 2017 |
| DATC RDF-2021: Design Flow and Beyond ICCAD Special Session Paper J Chen, IHR Jiang, J Jung, AB Kahng, S Kim, VN Kravets, YL Li, ... 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 1-6, 2021 | 10 | 2021 |
| Fast predictive useful skew methodology for timing-driven placement optimization S Kim, SG Do, S Kang Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017 | 10 | 2017 |
| RosettaStone: Connecting the Past, Present, and Future of Physical Design Research AB Kahng, M Kim, S Kim, M Woo IEEE Design & Test 39 (5), 70-78, 2022 | 7 | 2022 |
| Machine Learning Framework for Early Routability Prediction with Artificial Netlist Generator D Kim, H Kwo, SY Lee, S Kim, M Woo, S Kang 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp …, 2021 | 6 | 2021 |
| Enhanced Power Delivery Pathfinding for Emerging 3-D Integration Technology AB Kahng, S Kang, S Kim, B Xu IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1-14, 2020 | 6 | 2020 |
| Power delivery pathfinding for emerging die-to-wafer integration technology AB Kahng, S Kang, S Kim, K Samadi, B Xu 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE), 842-847, 2019 | 6 | 2019 |
| Analysis and reduction of voltage noise of multi-layer 3D IC with PEEC-based PDN and frequency-dependent TSV models S Kim, KJ Han, S Kang, Y Kim 2014 International SoC Design Conference (ISOCC), 124-125, 2014 | 6 | 2014 |
| Novel adaptive power gating strategy of TSV-based multi-layer 3D IC S Kim, S Kang, KJ Han, Y Kim Sixteenth International Symposium on Quality Electronic Design, 537-541, 2015 | 4 | 2015 |
| Power integrity coanalysis methodology for multi-domain high-speed memory systems S Kim, KJ Han, Y Kim, S Kang IEEE Access 7, 95305-95313, 2019 | 3 | 2019 |
| A preliminary analysis of domain coupling in package power distribution network B Bae, S Kim, Y Kim, S Kang, IJ Kim, K Kim, S Kang, KJ Han 2017 IEEE International Symposium on Radio-Frequency Integration Technology …, 2017 | 3 | 2017 |
| An optimal operating point by using error monitoring circuits with an error-resilient technique J Lee, S Kim, Y Kim, S Kang 2015 IFIP/IEEE International Conference on Very Large Scale Integration …, 2015 | 3 | 2015 |
| Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study S Kim, KJ Han, Y Kim, S Kang 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 885-888, 2018 | 2 | 2018 |
| Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network S Kim, Y Kim IEICE Electronics Express 14 (18), 20170792-20170792, 2017 | 2 | 2017 |
| Identification of parameter domain for the design of high-speed I/O interface S Kim, Y Kim, KJ Han 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 2 | 2015 |
| Skew control methodology for useful-skew implementation SG Do, S Kim, S Kang 2016 International SoC Design Conference (ISOCC), 221-222, 2016 | 1 | 2016 |
| Novel Adaptive Power-Gating Strategy and Tapered TSV Structure in Multilayer 3D IC S Kim, S Kang, KJ Han, Y Kim ACM Transactions on Design Automation of Electronic Systems (TODAES) 21 (3 …, 2016 | | 2016 |
