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Co-authors
- Hoondong NohETRIVerified email at etri.re.kr
- Younsun KimSamsungVerified email at samsung.com
- Donghan KimSamsung ElectronicsVerified email at samsung.com
- Hyoung-ju JiPrincipal Engineer of Samsung Electronics. LtdVerified email at samsung.com
- Jeongho YeoSamsung ElectronicsVerified email at samsung.com
- Md Saifur RahmanSamsung Research America - DallasVerified email at samsung.com
- Hyojin LeeQualcomm Technologies Inc.Verified email at postech.ac.kr
- Lee JuhoSamsung ElectronicsVerified email at samsung.com
- Young Han NamSamsungVerified email at samsung.com
- Sung Hwan WonNokiaVerified email at nokia.com
- Seong-Cheol KimDepartment of Electrical and Computer Engineering, College of Engineering, Seoul National UniversityVerified email at maxwell.snu.ac.kr
- Mattias FrenneEricssonVerified email at ericsson.com
- Hongbo SiSamsung Research AmericaVerified email at utexas.edu
- Sooyong ChoiSchool of Electrical and Electronic Engineering, Yonsei UniversityVerified email at yonsei.ac.kr
- Jong-Ho LeeProfessor, School of Electronic Engineering, Soongsil UniversityVerified email at ssu.ac.kr
- Yeon-Geun limNewracomVerified email at newratek.com
- Chan-Byoung ChaeUnderwood Distinguished Professor, Yonsei University, IEEE FellowVerified email at yonsei.ac.kr
- Kyungsik MinThe University of Suwon, Assistant ProfessorVerified email at suwon.ac.kr
- Kyeongin JeongIntelVerified email at intel.com
- Jang-Won LeeElectrical and Electronic Engineering, Yonsei University, Seoul, KoreaVerified email at yonsei.ac.kr