| Three‐dimensional printing of elastomeric, cellular architectures with negative stiffness EB Duoss, TH Weisgraber, K Hearon, C Zhu, W Small IV, TR Metz, ... Advanced Functional Materials 24 (31), 4905-4913, 2014 | 333 | 2014 |
| Encapsulated liquid sorbents for carbon dioxide capture JJ Vericella, SE Baker, JK Stolaroff, EB Duoss, JO Hardin IV, ... Nature Communications 6 (6124), 1-7, 2015 | 196 | 2015 |
| High‐throughput printing via microvascular multinozzle arrays CJ Hansen, R Saksena, DB Kolesky, JJ Vericella, SJ Kranz, ... Advanced Materials 25 (1), 96-102, 2013 | 167 | 2013 |
| Direct metal writing: Controlling the rheology through microstructure W Chen, L Thornley, HG Coe, SJ Tonneslan, JJ Vericella, C Zhu, ... Applied Physics Letters 110 (9), 2017 | 74 | 2017 |
| Encapsulated solvents for carbon dioxide capture RD Aines, CM Spaddaccini, EB Duoss, JK Stolaroff, J Vericella, JA Lewis, ... Energy Procedia 37, 219-224, 2013 | 27 | 2013 |
| Modeling and generating parallel flexure elements JB Hopkins, JJ Vericella, CD Harvey Precision Engineering 38 (3), 525-537, 2014 | 17 | 2014 |
| Multinozzle deposition system for direct write applications JA Lewis, CJ Hansen, S Kranz, JJ Vericella, W Wu, DB Kolesky US Patent 9,643,358, 2017 | 16 | 2017 |
| Separation of a target substance from a fluid or mixture using encapsulated sorbents RD Aines, CM Spadaccini, JK Stolaroff, WL Bourcier, JA Lewis, EB Duoss, ... US Patent 8,834,605, 2014 | 16 | 2014 |
| Separation of a target substance from a fluid or mixture using encapsulated sorbents RD Aines, CM Spadaccini, JK Stolaroff, WL Bourcier, JA Lewis, EB Duoss, ... US Patent 8,834,605, 2014 | 16 | 2014 |
| Inkjet Printing: High‐Throughput Printing via Microvascular Multinozzle Arrays (Adv. Mater. 1/2013) CJ Hansen, R Saksena, DB Kolesky, JJ Vericella, SJ Kranz, ... Advanced Materials 25 (1), 2-2, 2013 | 15 | 2013 |
| Encapsulated liquid sorbents for carbon dioxide capture Nat JJ Vericella, SE Baker, JK Stolaroff, EB Duoss, JO Hardin, J Lewicki, ... Commun 6, 6124, 2015 | 10 | 2015 |
| Cementing a wellbore using cementing material encapsulated in a shell RD Aines, WL Bourcier, EB Duoss, WC Floyd III, CM Spadaccini, ... US Patent 9,416,619, 2016 | 7 | 2016 |
| Smart tracers for geothermal reservoir assessment W DuFrance, J Vericella, E Duoss, M Smith, R Aines, J Roberts Lawrence Livermore National Lab.(LLNL), Livermore, CA (United States), 2014 | 7 | 2014 |
| Multifunctional reactive inks, methods of use and manufacture thereof K Sullivan, JM Densmore, E Duoss, AE Gash, J Kuntz, J Vericella US Patent 10,377,090, 2019 | 6 | 2019 |
| Bioreactors including enzyme-embedded multicomponent polymers JK Stolaroff, R Aines, S Baker, CD Blanchette, A Maiti, J Vericella, ... US Patent 10,202,567, 2019 | 3 | 2019 |
| Architected materials and structures to control shock output characteristics AE Gash, EB Duoss, JD Kuntz, KT Sullivan, J Vericella, BW White US Patent 10,036,616, 2018 | 3 | 2018 |
| Micro-encapsulation of advanced solvents for post-combustion carbon capture J Stolaroff, J Vericella, S Baker, C Spadaccini, E Duoss, R Aines 3rd Post Combustion Capture Conference (PCCC3), 2015 | 3 | 2015 |
| Fabrication and transport of double emulsion microcapsules for applications in unconventional resources P Roy*, SDC Walsh, WL Du Frane, JJ Vericella, WL Smith, JK Stolaroff, ... Unconventional Resources Technology Conference, San Antonio, Texas, 20-22 …, 2015 | 3 | 2015 |
| Lightweight micro lattices with nanoscale features fabricated from Projection Microstereolithography X Zheng, J Deotte, J Vericella, M Shusteff, T Weisgraber, H Lee, N Fang, ... 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems …, 2014 | 3 | 2014 |
| Additive micro-manufacturing of designer materials E Duoss, C Zhu, K Sullivan, J Vericella, J Hopkins, R Zheng, A Pascall, ... Materials Challenges and Testing for Manufacturing, Mobility, Biomedical …, 2014 | 3 | 2014 |
Christopher SpadacciniLawrence Livermore National Laboratory (current), Massachusetts Institute of Technology (previous)Verified email at alum.mit.edu
