Ki Jin Han
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Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
KJ Han, M Swaminathan, T Bandyopadhyay
Advanced Packaging, IEEE Transactions on 33 (4), 804-817, 2010
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
Optimal core shape design for cogging torque reduction of brushless DC motor using genetic algorithm
KJ Han, HS Cho, DH Cho, HK Jung
IEEE transactions on magnetics 36 (4), 1927-1931, 2000
Review of near-field wireless power and communication for biomedical applications
HJ Kim, H Hirayama, S Kim, KJ Han, R Zhang, JW Choi
IEEE Access 5, 21264 - 21285, 2017
Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions
D Shin, S Kim, G Jeong, J Park, J Park, KJ Han, J Kim
Electromagnetic Compatibility, IEEE Transactions on 57 (4), 660-671, 2015
Design and modeling for 3D ICs and interposers
M Swaminathan, KJ Han
World Scientific, 2013
Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
B Xie, M Swaminathan, KJ Han, J Xie
2011 IEEE International Symposium on Electromagnetic Compatibility, 16-21, 2011
Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions
KJ Han, M Swaminathan
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2009
Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections
KJ Han, M Swaminathan
Signal Propagation on Interconnects, 2009. SPI'09. IEEE Workshop on, 1-4, 2009
Electromagnetic modeling of interconnections in three-dimensional integration
KJ Han
Georgia Institute of Technology, 2009
Eye-pattern design for high-speed differential links using extended passive equalization
KJ Han, H Takeuchi, M Swaminathan
Advanced Packaging, IEEE Transactions on 31 (2), 246-257, 2008
Modeling electrical interconnections in three-dimensional structures
KJ Han, M Swaminathan
US Patent 8,352,242, 2013
Modeling of through-silicon via (TSV) interposer considering depletion capacitance and substrate layer thickness effects
KJ Han, M Swaminathan, J Jeong
Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
KJ Han, X Gu, YH Kwark, L Shan, MB Ritter
Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014
Estimation of high-frequency parameters of AC machine from transmission line model
Y Ryu, BR Park, KJ Han
IEEE Transactions on Magnetics 51 (3), 8101404, 2015
Design study on a 100-kA/20-K HTS cable for fusion magnets
S Hahn, J Song, Y Kim, KJ Han, H Lee, Y Iwasa, Y Chu
Applied Superconductivity, IEEE Transactions on 25 (3), 4801605, 2015
Design optimization for the insulation of HVDC converter transformers under composite electric stresses
M Yea, KJ Han, J Park, S Lee, J Choi
IEEE Transactions on Dielectrics and Electrical Insulation 25 (1), 253-262, 2018
Utilization of higher-mode resonance in broadening the E-plane HPBW of printed antenna for automotive radar application
R Patel, KJ Han
2015 International Workshop on Antenna Technology (iWAT), 330-332, 2015
Comparison study on harmonic loss of MW-class wind generators with HTS field winding
JH Seo, KJ Han, HS Choi, SH Lee, S Hahn, H Lee
Applied Superconductivity, IEEE Transactions on 24 (3), 5200105, 2014
Consideration of MOS capacitance effect in TSV modeling based on cylindrical modal basis functions
KJ Han, M Swaminathan
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 …, 2012
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