Evaluation of microstructural effects on corrosion behaviour of AZ91D magnesium alloy R Ambat, NN Aung, W Zhou Corrosion science 42 (8), 1433-1455, 2000 | 913 | 2000 |
Electroless nickel-plating on AZ91D magnesium alloy: effect of substrate microstructure and plating parameters R Ambat, W Zhou Surface and Coatings Technology 179 (2-3), 124-134, 2004 | 386 | 2004 |
The effect of welding parameters on the corrosion behaviour of friction stir welded AA2024–T351 M Jariyaboon, AJ Davenport, R Ambat, BJ Connolly, SW Williams, ... Corrosion science 49 (2), 877-909, 2007 | 367 | 2007 |
Effect of iron-containing intermetallic particles on the corrosion behaviour of aluminium R Ambat, AJ Davenport, GM Scamans, A Afseth Corrosion science 48 (11), 3455-3471, 2006 | 284 | 2006 |
Studies on the influence of chloride ion and pH on the corrosion and electrochemical behaviour of AZ91D magnesium alloy R Ambat, NN Aung, W Zhou Journal of applied electrochemistry 30, 865-874, 2000 | 264 | 2000 |
Intergranular corrosion and stress corrosion cracking of sensitised AA5182 AJ Davenport, Y Yuan, R Ambat, BJ Connolly, M Strangwood, A Afseth, ... Materials science forum 519, 641-646, 2006 | 153 | 2006 |
Studies on the influence of chloride ion and pH on the electrochemical behaviour of aluminium alloys 8090 and 2014 R Ambat, ES Dwarakadasa Journal of applied electrochemistry 24 (9), 911-916, 1994 | 142 | 1994 |
On the electrochemical migration mechanism of tin in electronics D Minzari, MS Jellesen, P Møller, R Ambat Corrosion Science 53 (10), 3366-3379, 2011 | 137 | 2011 |
Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems V Verdingovas, MS Jellesen, R Ambat Journal of Electronic Materials 44, 1116-1127, 2015 | 118 | 2015 |
Corrosion failure due to flux residues in an electronic add-on device MS Jellesen, D Minzari, U Rathinavelu, P Møller, R Ambat Engineering Failure Analysis 17 (6), 1263-1272, 2010 | 93 | 2010 |
Ferritic steels for fast reactor steam generators. A critical assessment SF Pugh, EA Little Nucl. Energy;(United Kingdom) 17 (3), 1978 | 91* | 1978 |
Electrochemical migration on electronic chip resistors in chloride environments D Minzari, MS Jellesen, P Moller, P Wahlberg, R Ambat IEEE Transactions on device and materials reliability 9 (3), 392-402, 2009 | 89 | 2009 |
Electrochemical migration of tin in electronics and microstructure of the dendrites D Minzari, FB Grumsen, MS Jellesen, P Møller, R Ambat Corrosion Science 53 (5), 1659-1669, 2011 | 84 | 2011 |
Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies V Verdingovas, MS Jellesen, R Ambat IEEE Transactions on Device and Materials Reliability 14 (1), 42-51, 2013 | 75 | 2013 |
Electrochemical behavior of the active surface layer on rolled aluminum alloy sheet R Ambat, AJ Davenport, A Afseth, G Scamans Journal of the Electrochemical Society 151 (2), B53, 2004 | 75 | 2004 |
Effect of hydrogen in aluminium and aluminium alloys: A review R Ambat, ES Dwarakadasa Bulletin of Materials Science 19, 103-114, 1996 | 72 | 1996 |
Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components V Verdingovas, MS Jellesen, R Ambat Corrosion Engineering, Science and Technology 48 (6), 426-435, 2013 | 66 | 2013 |
Effect of solder flux residues on corrosion of electronics KS Hansen, MS Jellesen, P Moller, PJS Westermann, R Ambat 2009 Annual Reliability and Maintainability Symposium, 502-508, 2009 | 66 | 2009 |
Relative effect of solder flux chemistry on the humidity related failures in electronics V Verdingovas, MS Jellesen, R Ambat Soldering & Surface Mount Technology 27 (4), 146-156, 2015 | 62 | 2015 |
The influence of pH on the corrosion of medium strength aerospace alloys 8090, 2091 and 2014 R Ambat, ES Dwarakadasa Corrosion Science 33 (5), 681-690, 1992 | 60 | 1992 |