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Rajan Ambat
Rajan Ambat
Professor of Corrosion and Surface Engineering
Verified email at mek.dtu.dk
Title
Cited by
Cited by
Year
Evaluation of microstructural effects on corrosion behaviour of AZ91D magnesium alloy
R Ambat, NN Aung, W Zhou
Corrosion science 42 (8), 1433-1455, 2000
9132000
Electroless nickel-plating on AZ91D magnesium alloy: effect of substrate microstructure and plating parameters
R Ambat, W Zhou
Surface and Coatings Technology 179 (2-3), 124-134, 2004
3862004
The effect of welding parameters on the corrosion behaviour of friction stir welded AA2024–T351
M Jariyaboon, AJ Davenport, R Ambat, BJ Connolly, SW Williams, ...
Corrosion science 49 (2), 877-909, 2007
3672007
Effect of iron-containing intermetallic particles on the corrosion behaviour of aluminium
R Ambat, AJ Davenport, GM Scamans, A Afseth
Corrosion science 48 (11), 3455-3471, 2006
2842006
Studies on the influence of chloride ion and pH on the corrosion and electrochemical behaviour of AZ91D magnesium alloy
R Ambat, NN Aung, W Zhou
Journal of applied electrochemistry 30, 865-874, 2000
2642000
Intergranular corrosion and stress corrosion cracking of sensitised AA5182
AJ Davenport, Y Yuan, R Ambat, BJ Connolly, M Strangwood, A Afseth, ...
Materials science forum 519, 641-646, 2006
1532006
Studies on the influence of chloride ion and pH on the electrochemical behaviour of aluminium alloys 8090 and 2014
R Ambat, ES Dwarakadasa
Journal of applied electrochemistry 24 (9), 911-916, 1994
1421994
On the electrochemical migration mechanism of tin in electronics
D Minzari, MS Jellesen, P Møller, R Ambat
Corrosion Science 53 (10), 3366-3379, 2011
1372011
Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems
V Verdingovas, MS Jellesen, R Ambat
Journal of Electronic Materials 44, 1116-1127, 2015
1182015
Corrosion failure due to flux residues in an electronic add-on device
MS Jellesen, D Minzari, U Rathinavelu, P Møller, R Ambat
Engineering Failure Analysis 17 (6), 1263-1272, 2010
932010
Ferritic steels for fast reactor steam generators. A critical assessment
SF Pugh, EA Little
Nucl. Energy;(United Kingdom) 17 (3), 1978
91*1978
Electrochemical migration on electronic chip resistors in chloride environments
D Minzari, MS Jellesen, P Moller, P Wahlberg, R Ambat
IEEE Transactions on device and materials reliability 9 (3), 392-402, 2009
892009
Electrochemical migration of tin in electronics and microstructure of the dendrites
D Minzari, FB Grumsen, MS Jellesen, P Møller, R Ambat
Corrosion Science 53 (5), 1659-1669, 2011
842011
Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies
V Verdingovas, MS Jellesen, R Ambat
IEEE Transactions on Device and Materials Reliability 14 (1), 42-51, 2013
752013
Electrochemical behavior of the active surface layer on rolled aluminum alloy sheet
R Ambat, AJ Davenport, A Afseth, G Scamans
Journal of the Electrochemical Society 151 (2), B53, 2004
752004
Effect of hydrogen in aluminium and aluminium alloys: A review
R Ambat, ES Dwarakadasa
Bulletin of Materials Science 19, 103-114, 1996
721996
Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components
V Verdingovas, MS Jellesen, R Ambat
Corrosion Engineering, Science and Technology 48 (6), 426-435, 2013
662013
Effect of solder flux residues on corrosion of electronics
KS Hansen, MS Jellesen, P Moller, PJS Westermann, R Ambat
2009 Annual Reliability and Maintainability Symposium, 502-508, 2009
662009
Relative effect of solder flux chemistry on the humidity related failures in electronics
V Verdingovas, MS Jellesen, R Ambat
Soldering & Surface Mount Technology 27 (4), 146-156, 2015
622015
The influence of pH on the corrosion of medium strength aerospace alloys 8090, 2091 and 2014
R Ambat, ES Dwarakadasa
Corrosion Science 33 (5), 681-690, 1992
601992
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