| Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints J Meng, K Kawakami, AK Coskun Proceedings of the 49th Annual Design Automation Conference, 648-655, 2012 | 185 | 2012 |
| Accelerated microwave design optimization with tuning space mapping S Koziel, J Meng, JW Bandler, MH Bakr, QS Cheng IEEE Transactions on Microwave Theory and Techniques 57 (2), 383-394, 2009 | 116 | 2009 |
| Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 54 | 2013 |
| Tuning space mapping: A novel technique for engineering design optimization J Meng, S Koziel, JW Bandler, MH Bakr, QS Cheng 2008 IEEE MTT-S International Microwave Symposium Digest, 991-994, 2008 | 50 | 2008 |
| SST+ gem5= a scalable simulation infrastructure for high performance computing M Hsieh, J Meng, M Levenhagen, K Pedretti, A Coskun, A Rodrigues Fifth International Conference on Simulation Tools and Techniques, 2012 | 48 | 2012 |
| Analysis and runtime management of 3D systems with stacked DRAM for boosting energy efficiency J Meng, AK Coskun 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 611-616, 2012 | 37 | 2012 |
| Simulation and optimization of HPC job allocation for jointly reducing communication and cooling costs J Meng, S McCauley, F Kaplan, VJ Leung, AK Coskun Sustainable Computing: Informatics and Systems 6, 48-57, 2015 | 32 | 2015 |
| Optimizing communication and cooling costs in HPC data centers via intelligent job allocation F Kaplan, J Meng, AK Coskun 2013 International Green Computing Conference Proceedings, 1-10, 2013 | 25 | 2013 |
| Attaining single-chip, high-performance computing through 3D systems with active cooling A Coskun, D Atienza, M Sabry, J Meng IEEE Micro 31 (4), 63-75, 2011 | 24 | 2011 |
| Run-time energy management of manycore systems through reconfigurable interconnects J Meng, C Chen, AK Coskun, A Joshi Proceedings of the 21st edition of the great lakes symposium on Great lakes …, 2011 | 23 | 2011 |
| Scalable distributed high-order stencil computations M Jacquelin, M Araya–Polo, J Meng SC22: International Conference for High Performance Computing, Networking …, 2022 | 21 | 2022 |
| Accelerating high-order stencils on GPUs R Sai, J Mellor-Crummey, X Meng, M Araya-Polo, J Meng 2020 IEEE/ACM Performance Modeling, Benchmarking and Simulation of High …, 2020 | 21 | 2020 |
| Communication and cooling aware job allocation in data centers for communication-intensive workloads J Meng, E Llamosí, F Kaplan, C Zhang, J Sheng, M Herbordt, G Schirner, ... Journal of Parallel and Distributed Computing 96, 181-193, 2016 | 18 | 2016 |
| Minimod: A finite difference solver for seismic modeling J Meng, A Atle, H Calandra, M Araya-Polo arXiv preprint arXiv:2007.06048, 2020 | 15 | 2020 |
| Evaluating performance of OpenMP tasks in a seismic stencil application E Raut, J Meng, M Araya-Polo, B Chapman OpenMP: Portable Multi-Level Parallelism on Modern Systems: 16th …, 2020 | 14 | 2020 |
| Dynamic cache pooling in 3D multicore processors T Zhang, J Meng, AK Coskun ACM Journal on Emerging Technologies in Computing Systems (JETC) 12 (2), 1-21, 2015 | 13 | 2015 |
| Towards efficient remote openmp offloading W Lu, B Shan, E Raut, J Meng, M Araya-Polo, J Doerfert, AM Malik, ... International Workshop on OpenMP, 17-31, 2022 | 11 | 2022 |
| Porting and evaluation of a distributed task-driven stencil-based application E Raut, J Anderson, M Araya-Polo, J Meng Proceedings of the 12th International Workshop on Programming Models and …, 2021 | 10 | 2021 |
| 3D systems with on-chip DRAM for enabling low-power high-performance computing J Meng, D Rossell, AK Coskun IEEE High Performance Embedded Computing, HPEC, 1-4, 2011 | 10 | 2011 |
| Express virtual channels with taps (EVC-T): A flow control technique for network-on-chip (NoC) in manycore systems C Chen, J Meng, AK Coskun, A Joshi 2011 IEEE 19th Annual Symposium on High Performance Interconnects, 1-10, 2011 | 9 | 2011 |
