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Mark HersamNorthwestern UniversityVerified email at northwestern.edu
Joshua D. WoodSolutions Engineering Manager, DynatraceVerified email at dynatrace.com
Vinod K. SangwanMaterials Science and Engineering, Northwestern University, Evanston, IL 60208Verified email at northwestern.edu
Deep JariwalaUniversity of Pennsylvania, Caltech, Northwestern University, Rice UniversityVerified email at seas.upenn.edu
Kan-Sheng ChenNorthwestern UniversityVerified email at northwestern.edu
Christopher R RyderBooz Allen HamiltonVerified email at u.northwestern.edu
Lincoln J LauhonNorthwestern UniversityVerified email at northwestern.edu
Joohoon KangSungkyunkwan University (SKKU)Verified email at skku.edu
Jae-Hyeok LeeDepartment of Materials Science & Engineering, Northwestern UniversityVerified email at northwestern.edu
Jian ZhuProfessor, Nankai UniversityVerified email at nankai.edu.cn
Yang YangBASFVerified email at basf.com
Shumao Cui (崔树茂)University of Wisconsin MilwaukeeVerified email at uwm.edu
Junmo KangPostdoctoral fellow, Northwestern UniversityVerified email at northwestern.edu
Yongsuk ChoiDepartment of Medical Engineering, California Institute of TechnologyVerified email at caltech.edu
Jeong Ho ChoYonsei UniversityVerified email at yonsei.ac.kr
Lintao PengArgonne, Nanoscience and Technology, Ph.D Northwestern UniversityVerified email at u.northwestern.edu
Jeffrey R. GuestExperimental Physicist, Argonne National Laboratory, University of MichiganVerified email at anl.gov
Itamar BallaIntel Corp.Verified email at u.northwestern.edu
Hyun-Joong ChungAssociate Professor of Chemical & Materials Engineering, University of AlbertaVerified email at ualberta.ca