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Jian ZhuSchool of Science and Engineering, Chinese University of Hong Kong, Shenzhen, ChinaVerified email at cuhk.edu.cn
Wang YuzheSingapore Institute of Manufacturing Technology, Agency for Science Technology and ResearchVerified email at simtech.a-star.edu.sg
Keith Choon Chiang FooPrincipal Scientist, A*STAR IHPC. Previously with Harvard, NTUVerified email at ihpc.a-star.edu.sg
Hareesh GodabaUniversity of SussexVerified email at sussex.ac.uk
QIN LEIResearch Engineer, Mechanical Engineering, National University of SingaporeVerified email at u.nus.edu
Guoying Gu (谷国迎)Professor, Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Xiangyang ZhuShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Jianyong OuyangNational University of SingaporeVerified email at nus.edu.sg
Jun LiuIHPC, A*STARVerified email at ihpc.a-star.edu.sg
Zhi-Qian ZHANG (Zhiqian Zhang)Principle Scientist, Institute of High Performance Computing, A*STARVerified email at ihpc.a-star.edu.sg
Gim Song SohAssociate Professor, Singapore University of Technology and DesignVerified email at sutd.edu.sg
Hong Yee LowAssociate Professor, Singapore University of Technology and DesignVerified email at sutd.edu.sg
Wen Feng LuMechanical Engineering, national University of SingaporeVerified email at nus.edu.sg
Chee Kong ChuiAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
Feifei Chen (陈飞飞)Associate Professor, Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Jiawei CaoNational University of SingaporeVerified email at u.nus.edu
Liang WenyuA*STAR Institute for Infocomm Research; National University of SingaporeVerified email at i2r.a-star.edu.sg
Hongliang RenChinese University of Hong Kong | National University of Singapore | JHU/Harvard(RF) | CUHK(PhD)Verified email at jhu.edu
H Y K LauRemote Applications in Challenging Environments, UK Atomic Energy AuthorityVerified email at ukaea.uk
Lucienne BlessingProfessor, Engineering Product DevelopmentVerified email at sutd.edu.sg