3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 463-470, 2010 | 402 | 2010 |
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs A Sridhar, A Vincenzi, D Atienza, T Brunschwiler IEEE Transactions on Computers 63 (10), 2576-2589, 2013 | 141 | 2013 |
Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza 2010 16th International workshop on thermal investigations of ICs and …, 2010 | 82 | 2010 |
Evaluation and classification of physical and psychological stress in firefighters using heart rate variability U Pluntke, S Gerke, A Sridhar, J Weiss, B Michel 2019 41st Annual International Conference of the IEEE Engineering in …, 2019 | 67 | 2019 |
Thermal modeling and analysis of 3D multi-processor chips JL Ayala, A Sridhar, D Cuesta Integration 43 (4), 327-341, 2010 | 59 | 2010 |
Through silicon via-based grid for thermal control in 3D chips JL Ayala, A Sridhar, V Pangracious, D Atienza, Y Leblebici International Conference on Nano-Networks, 90-98, 2009 | 58 | 2009 |
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 54 | 2013 |
DeStress: deep learning for unsupervised identification of mental stress in firefighters from heart-rate variability (HRV) data A Oskooei, SM Chau, J Weiss, A Sridhar, MR Martínez, B Michel Explainable AI in Healthcare and Medicine: Building a Culture of …, 2021 | 46 | 2021 |
Neural network-based thermal simulation of integrated circuits on GPUs A Sridhar, A Vincenzi, M Ruggiero, D Atienza IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 46 | 2011 |
Radial hierarchical microfluidic evaporative cooling for 3-d integrated microprocessors CL Ong, S Paredes, A Sridhar, B Michel, T Brunschwiler Proc. 4th European Conference on Microfluidics, Limerick, 2014 | 41 | 2014 |
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs A Vincenzi, A Sridhar, M Ruggiero, D Atienza IEEE/ACM International Symposium on Low Power Electronics and Design, 151-156, 2011 | 40 | 2011 |
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling MM Sabry, A Sridhar, D Atienza, Y Temiz, Y Leblebici, S Szczukiewicz, ... 2011 Design, Automation & Test in Europe, 1-6, 2011 | 37 | 2011 |
Parallel and scalable transient simulator for power grids via waveform relaxation (PTS-PWR) R Achar, MS Nakhla, HS Dhindsa, AR Sridhar, D Paul, NM Nakhla IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (2), 319-332, 2009 | 32 | 2009 |
Counter-flow expanding channels for enhanced two-phase heat removal TJ Brunschwiler, TJ Chainer, EG Colgan, ARM Sridhar, CL Ong, ... US Patent 9,941,189, 2018 | 28 | 2018 |
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal T Brunschwiler, A Sridhar, C Lee Ong, G Schlottig Journal of Electronic Packaging 138 (1), 010911, 2016 | 26 | 2016 |
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits A Sridhar, Y Madhour, D Atienza, T Brunschwiler, J Thome 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 256-263, 2013 | 23 | 2013 |
Thermal balancing of liquid-cooled 3d-mpsocs using channel modulation MM Sabry, A Sridhar, D Atienza 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 599-604, 2012 | 23 | 2012 |
PowerCool: Simulation of cooling and powering of 3D MPSoCs with integrated flow cell arrays AA Andreev, A Sridhar, MM Sabry, M Zapater, P Ruch, B Michel, ... IEEE Transactions on Computers 67 (1), 73-85, 2017 | 22 | 2017 |
Thermal model for embedded two-phase liquid cooled microprocessor PR Parida, A Sridhar, A Vega, MD Schultz, M Gaynes, O Ozsun, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 21 | 2017 |
Modeling and multi-objective optimization of 2.5 D inductor-based Fully Integrated Voltage Regulators for microprocessor applications PAM Bezerra, F Krismer, TM Andersen, JW Kolar, A Sridhar, ... 2015 IEEE 13th Brazilian Power Electronics Conference and 1st Southern Power …, 2015 | 19 | 2015 |