Fredrik Forsberg
Cited by
Cited by
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
Integrating mems and ics
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 1-16, 2015
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ...
Nature Electronics 2 (9), 394-404, 2019
Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE (+) dual-cure polymer
F Saharil, F Forsberg, Y Liu, P Bettotti, N Kumar, F Niklaus, T Haraldsson, ...
Journal of Micromechanics and Microengineering 23 (2), 025021, 2013
Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications
X Fan, AD Smith, F Forsberg, S Wagner, S Schröder, SSA Akbari, ...
Microsystems & Nanoengineering 6 (1), 17, 2020
Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
F Niklaus, A Decharat, F Forsberg, N Roxhed, M Lapisa, M Populin, ...
Sensors and Actuators A: Physical 154 (1), 180-186, 2009
Suspended graphene membranes with attached silicon proof masses as piezoresistive nanoelectromechanical systems accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, M Östling, ...
Nano letters 19 (10), 6788-6799, 2019
CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration
F Forsberg, A Lapadatu, G Kittilsland, S Martinsen, N Roxhed, AC Fischer, ...
IEEE Journal of Selected Topics in Quantum Electronics 21 (4), 30-40, 2014
Low-cost uncooled microbolometers for thermal imaging
N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ...
Optical sensing and detection 7726, 315-324, 2010
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ...
Infrared physics & technology 60, 251-259, 2013
High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers
F Forsberg, N Roxhed, P Ericsson, S Wissmar, F Niklaus, G Stemme
TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009
Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays
P Ericsson, AC Fischer, F Forsberg, N Roxhed, B Samel, S Savage, ...
Infrared Technology and Applications XXXVII 8012, 411-420, 2011
Far infrared low-cost uncooled bolometer for automotive use
T Kvisterøy, H Jakobsen, C Vieider, S Wissmar, P Ericsson, U Halldin, ...
Advanced Microsystems for Automotive Applications, 265-278, 2007
High-resolution micropatterning of off-stochiometric thiol-enes (OSTE) via a novel lithography mechanism
F Carlborg, F Saharil, F Forsberg, F Niklaus, W van der Wijngaart, ...
16th International Conference on Miniaturized Systems for Chemistry and Life …, 2012
A comparative study of the bonding energy in adhesive wafer bonding
F Forsberg, F Saharil, T Haraldsson, N Roxhed, G Stemme, ...
Journal of Micromechanics and Microengineering 23 (8), 085019, 2013
Wafer-level heterogeneous 3D integration for MEMS and NEMS
F Niklaus, M Lapisa, SJ Bleiker, V Dubois, N Roxhed, AC Fischer, ...
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012
Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate
F Forsberg, N Roxhed, G Stemme, F Niklaus
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011
Batch transfer of radially expanded die arrays for heterogeneous integration using different wafer sizes
F Forsberg, N Roxhed, T Haraldsson, Y Liu, G Stemme, F Niklaus
Journal of microelectromechanical systems 21 (5), 1077-1083, 2012
The system can't perform the operation now. Try again later.
Articles 1–20