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Mark HersamNorthwestern UniversityVerified email at northwestern.edu- Joseph W. LydingProfessor of Electrical and Computer Engineering, University of IllinoisVerified email at illinois.edu
- Eric PopPease-Ye Professor of Electrical Engineering & Materials Science, Stanford UniversityVerified email at stanford.edu
- Kan-Sheng ChenNorthwestern UniversityVerified email at northwestern.edu
- Spencer WellsResearch Scientist, FacebookVerified email at u.northwestern.edu
- Joohoon KangSungkyunkwan University (SKKU)Verified email at skku.edu
- Scott W. SchmuckerSandia National LaboratoriesVerified email at sandia.gov
- Vinod K. SangwanMaterials Science and Engineering, Northwestern University, Evanston, IL 60208Verified email at northwestern.edu
- Deep JariwalaUniversity of Pennsylvania, Caltech, Northwestern University, Rice UniversityVerified email at seas.upenn.edu
- Jeffrey R. GuestExperimental Physicist, Argonne National Laboratory, University of MichiganVerified email at anl.gov
- Christopher R RyderBooz Allen HamiltonVerified email at u.northwestern.edu
- Andrew J. MannixAssistant Professor, Materials Science & Engineering, Stanford UniversityVerified email at stanford.edu
- Brian KiralyNorthwestern UniversityVerified email at u.northwestern.edu
- David EstradaAssociate Professor of MSE at Boise State; Co-Founder of INFlex LabsVerified email at boisestate.edu
- Lincoln J LauhonNorthwestern UniversityVerified email at northwestern.edu
- Chad Husko, Ph.D.Founder/CEO, Iris Light TechnologiesVerified email at irislighttech.com
- Arturo Ponce PedrazaDepartment of Physics & Astronomy at University of Texas at San AntonioVerified email at utsa.edu
- Kevin HeGraduate Student, UIUCVerified email at illinois.edu
- Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
- Jian ZhuProfessor, Nankai UniversityVerified email at nankai.edu.cn
