Magnesium, magnesium alloys, and magnesium composites M Gupta, SNM Ling John Wiley & Sons, 2011 | 580 | 2011 |
Hierarchical microstructure and strengthening mechanisms of a CoCrFeNiMn high entropy alloy additively manufactured by selective laser melting ZG Zhu, QB Nguyen, FL Ng, XH An, XZ Liao, PK Liaw, SML Nai, J Wei Scripta Materialia 154, 20-24, 2018 | 561 | 2018 |
Microstructure and enhanced strength of laser aided additive manufactured CoCrFeNiMn high entropy alloy Y Chew, GJ Bi, ZG Zhu, FL Ng, F Weng, SB Liu, SML Nai, BY Lee Materials Science and Engineering: A 744, 137-144, 2019 | 228 | 2019 |
Effects of processing parameters on surface roughness of additive manufactured Ti-6Al-4V via electron beam melting P Wang, WJ Sin, MLS Nai, J Wei Materials 10 (10), 1121, 2017 | 211* | 2017 |
Low temperature wafer anodic bonding J Wei, H Xie, ML Nai, CK Wong, LC Lee Journal of Micromechanics and Microengineering 13 (2), 217, 2003 | 210 | 2003 |
Effect of different heat treatments on the microstructure and mechanical properties in selective laser melted INCONEL 718 alloy S Raghavan, B Zhang, P Wang, CN Sun, MLS Nai, T Li, J Wei Materials and Manufacturing Processes 32 (14), 1588-1595, 2017 | 207 | 2017 |
Microstructure and mechanical properties of hypo/hyper-eutectic Al–Si alloys synthesized using a near-net shape forming technique M Gupta, S Ling Journal of Alloys and Compounds 287 (1-2), 284-294, 1999 | 200 | 1999 |
Additively manufactured CoCrFeNiMn high-entropy alloy via pre-alloyed powder P Wang, P Huang, FL Ng, WJ Sin, S Lu, MLS Nai, ZL Dong, J Wei Materials & Design 168, 107576, 2019 | 188 | 2019 |
Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes SML Nai, J Wei, M Gupta Materials Science and Engineering: A 423 (1-2), 166-169, 2006 | 183 | 2006 |
Interfacial intermetallic growth and shear strength of lead-free composite solder joints SML Nai, J Wei, M Gupta Journal of Alloys and Compounds 473 (1-2), 100-106, 2009 | 176 | 2009 |
Superior mechanical properties of a selective-laser-melted AlZnMgCuScZr alloy enabled by a tunable hierarchical microstructure and dual-nanoprecipitation Z Zhu, FL Ng, HL Seet, W Lu, CH Liebscher, Z Rao, D Raabe, SML Nai Materials Today 52, 90-101, 2022 | 173 | 2022 |
Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites SML Nai, J Wei, M Gupta Thin Solid Films 504 (1-2), 401-404, 2006 | 166 | 2006 |
On the machining of selective laser melting CoCrFeMnNi high-entropy alloy J Guo, M Goh, Z Zhu, X Lee, MLS Nai, J Wei Materials & Design 153, 211-220, 2018 | 165 | 2018 |
Selective laser melting enabling the hierarchically heterogeneous microstructure and excellent mechanical properties in an interstitial solute strengthened high entropy alloy ZG Zhu, XH An, WJ Lu, ZM Li, FL Ng, XZ Liao, U Ramamurty, SML Nai, ... Materials Research Letters 7 (11), 453-459, 2019 | 164 | 2019 |
The role of powder layer thickness on the quality of SLM printed parts QB Nguyen, DN Luu, SML Nai, Z Zhu, Z Chen, J Wei Archives of Civil and Mechanical Engineering 18, 948-955, 2018 | 158 | 2018 |
Characteristics of inconel powders for powder-bed additive manufacturing QB Nguyen, MLS Nai, Z Zhu, CN Sun, J Wei, W Zhou Engineering 3 (5), 695-700, 2017 | 158 | 2017 |
Spatial and geometrical-based characterization of microstructure and microhardness for an electron beam melted Ti–6Al–4V component P Wang, X Tan, MLS Nai, SB Tor, J Wei Materials & Design 95, 287-295, 2016 | 156 | 2016 |
Selective laser melting of dispersed TiC particles strengthened 316L stainless steel W Zhai, Z Zhu, W Zhou, SML Nai, J Wei Composites Part B: Engineering 199, 108291, 2020 | 148 | 2020 |
Effect of carbon nanotubes on the shear strength and electrical resistivity of a lead-free solder SML Nai, J Wei, M Gupta Journal of electronic materials 37, 515-522, 2008 | 139 | 2008 |
Microhardness and microstructure evolution of TiB2 reinforced Inconel 625/TiB2 composite produced by selective laser melting B Zhang, G Bi, S Nai, C Sun, J Wei Optics & Laser Technology 80, 186-195, 2016 | 134 | 2016 |