| Graded microstructure and mechanical properties of additive manufactured Ti–6Al–4V via electron beam melting X Tan, Y Kok, YJ Tan, M Descoins, D Mangelinck, SB Tor, KF Leong, ... Acta Materialia 97, 1-16, 2015 | 699 | 2015 |
| Enhancement of thermal stability of NiSi films on (100) Si and (111) Si by Pt addition D Mangelinck, JY Dai, JS Pan, SK Lahiri Applied physics letters 75 (12), 1736-1738, 1999 | 340 | 1999 |
| Revealing martensitic transformation and α/β interface evolution in electron beam melting three-dimensional-printed Ti-6Al-4V X Tan, Y Kok, WQ Toh, YJ Tan, M Descoins, D Mangelinck, SB Tor, ... Scientific reports 6 (1), 26039, 2016 | 231 | 2016 |
| Impact of directional walk on atom probe microanalysis B Gault, F Danoix, K Hoummada, D Mangelinck, H Leitner Ultramicroscopy 113, 182-191, 2012 | 156 | 2012 |
| Reducing hot tearing by grain boundary segregation engineering in additive manufacturing: example of an AlxCoCrFeNi high-entropy alloy Z Sun, X Tan, C Wang, M Descoins, D Mangelinck, SB Tor, EA Jägle, ... Acta Materialia 204, 116505, 2021 | 154 | 2021 |
| Revealing hot tearing mechanism for an additively manufactured high-entropy alloy via selective laser melting Z Sun, XP Tan, M Descoins, D Mangelinck, SB Tor, CS Lim Scripta Materialia 168, 129-133, 2019 | 139 | 2019 |
| New salicidation technology with Ni (Pt) alloy for MOSFETs PS Lee, KL Pey, D Mangelinck, J Ding, DZ Chi, L Chan IEEE Electron Device Letters 22 (12), 568-570, 2001 | 130 | 2001 |
| Morphological and phase stability of nickel–germanosilicide on under thermal stress T Jarmar, J Seger, F Ericson, D Mangelinck, U Smith, SL Zhang Journal of applied physics 92 (12), 7193-7199, 2002 | 113 | 2002 |
| Effect of Co, Pt, and Au additions on the stability and epitaxy of films on (111)Si D Mangelinck, P Gas, JM Gay, B Pichaud, O Thomas Journal of Applied Physics 84 (5), 2583-2590, 1998 | 101 | 1998 |
| Differential scanning calorimetry analysis of the linear parabolic growth of nanometric Ni silicide thin films on a Si substrate F Nemouchi, D Mangelinck, C Bergman, P Gas, U Smith Applied Physics Letters 86 (4), 2005 | 94 | 2005 |
| Micro‐Raman Spectroscopy Investigation of Nickel Silicides and Nickel (Platinum) Silicides PS Lee, D Mangelinck, KL Pey, ZX Shen, J Ding, T Osipowicz, A See Electrochemical and Solid-State Letters 3 (3), 153, 2000 | 91 | 2000 |
| Increased nucleation temperature of in the reaction of Ni thin films with J Seger, SL Zhang, D Mangelinck, HH Radamson Applied physics letters 81 (11), 1978-1980, 2002 | 86 | 2002 |
| Carbide precipitation characteristics in additive manufacturing of Co-Cr-Mo alloy via selective electron beam melting XP Tan, P Wang, Y Kok, WQ Toh, Z Sun, SML Nai, M Descoins, ... Scripta Materialia 143, 117-121, 2018 | 75 | 2018 |
| Simultaneous growth of Ni5Ge3 and NiGe by reaction of Ni film with Ge F Nemouchi, D Mangelinck, C Bergman, G Clugnet, P Gas, JL Lábár Applied Physics Letters 89 (13), 2006 | 68 | 2006 |
| Snowplow effect and reactive diffusion in the Pt doped Ni–Si system O Cojocaru-Mirédin, D Mangelinck, K Hoummada, E Cadel, D Blavette, ... Scripta materialia 57 (5), 373-376, 2007 | 66 | 2007 |
| Effect of Ru additions on very high temperature creep properties of a single crystal Ni-based superalloy XP Tan, JL Liu, T Jin, ZQ Hu, HU Hong, BG Choi, IS Kim, CY Jo, ... Materials Science and Engineering: A 580, 21-35, 2013 | 65 | 2013 |
| Three-dimensional composition mapping of NiSi phase distribution and Pt diffusion via grain boundaries in Ni2Si D Mangelinck, K Hoummada, A Portavoce, C Perrin, R Daineche, ... Scripta Materialia 62 (8), 568-571, 2010 | 62 | 2010 |
| A comparative study of nickel silicides and nickel germanides: Phase formation and kinetics F Nemouchi, D Mangelinck, JL Lábár, M Putero, C Bergman, P Gas Microelectronic Engineering 83 (11-12), 2101-2106, 2006 | 60 | 2006 |
| Effect of Pt addition on Ni silicide formation at low temperature: Growth, redistribution, and solubility K Hoummada, C Perrin-Pellegrino, D Mangelinck Journal of Applied Physics 106 (6), 2009 | 59 | 2009 |
| On the Ni–Si phase transformation with/without native oxide PS Lee, D Mangelinck, KL Pey, J Ding, JY Dai, CS Ho, A See Microelectronic Engineering 51, 583-594, 2000 | 59 | 2000 |
